Posted by Intel is the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
OR Die Prep Process Engineer
Job Description
Designing and planning the layout for such processes as hardening, washing, laminating, etching, engraving, polishing, painting, plating, and other material processing operations.
Planning the sequence of operations and specifying procedures for cutting, shaping, and otherwise preparing basic material, exercising judgment in compromising between conflicting requirements, economic evaluation of methods, and operator effectiveness and comfort.
Conducting tests and measurements throughout stages of production to determine control over such variables as temperature, density, specific gravity, pressure, and viscosity.
Establishing and submitting processing requirements to be met in designing and acquiring processing equipment.
Responding to customer/client requests or events as they occur.
Developing solutions to problems.
This is an entry level position and will be compensated accordingly.
Minimum Qualifications:
Candidate must possess a Bachelor’s or Master’s degree in an Engineering and/or Science discipline such as Physics, Applied Physics, Chemistry, Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, etc.